Technology leader ASM will present many hardware and software innovations for the integrated smart factory at the Nepcon China 2021 trade show (Shanghai, April 21-23, Booth 1F60). An absolute highlight will be the latest generation of the high-performance SIPLACE TX micron placement machine for advanced packaging and high-density applications, along with smart ASM factory solutions that synchronize all production resources for optimized performance. In the ‘Experience Area’, visitors can see the advantages of automated, AIV-supported material logistics and experience how smart operator pools work much more efficiently and reliably with guidance from ASM Command Center software and state-of-the-art augmented reality techniques.
“The Chinese market and volume-driven factories are extremely demanding in terms of performance, quality and efficiency. At the Nepcon trade show in Shanghai we will bring to life the immense progress we have made in the integrated smart factory,” explains Herbert Hofmann, Vice President and Managing Director ASM Assembly Systems China at ASM. “We are also looking forward to meeting customers and interested parties on this very important show. A major portion of the presentations will focus on advanced packaging with the new SIPLACE TX micron as well as on DEK MASS, our solution for printing on singulated substrates. Other customers will also be excited about our mostly autonomous AIV-supported material supply systems.”
ASM’s ‘Integrated Smart Factory Solution’
Under the motto ‘ASM Integrated Smart Factory Solution’, smart ASM hardware and software solutions will synchronize the four production factors People, Equipment, Material and Processes to deliver more efficient workflows ranging from planning to material management, production, and factory-wide integration. Customers will benefit from the optimized use of equipment and people, more resiliency through a comprehensively connected production flow, smartly automated material supplies, and significantly improved quality and yield through closed-loop systems.
Maximum precision and efficiency for SiPs and modules
The latest generation of the SIPLACE TX micron raises advanced packaging and high-density applications to a new level of productivity, efficiency, and quality. With a 23-percent increase in performance, placement accuracies of up to 15 µm @ 3s and component distances of as little as 50 µm, the SIPLACE TX micron is the fastest and most precise machine ASM has ever developed. For sensitive parts such as thin dies, flip-chips or 0201m components, the placement process can be programmed for each individual component and position with features like touchless pickup and zero-force placement. Innovative functions like cracked-die inspection and die chipping detection recognize faulty thin dies and reject them before they are placed. The SIPLACE TX micron takes up only 2.23 by 1.0 meters of floorspace and is Class 7-certified as per DIN EN ISO 14644-1, making it ideal for use in tight cleanroom environments.
Industry-leading SPI expert system
The latest version of the ASM ProcessExpert, the world’s first self-learning inline SPI system, opens up new possibilities for controlling and optimizing printing processes. Features for faster programming deliver exceptional flexibility, and the solution’s full support of IPC Hermes 9852 and IPC CFX ensures its complete integration into the process communication.
Software solutions for the integrated smart factory
The broad portfolio of high-performance ASM software solutions provides the basis for the integrated smart factory. ASM Factory Equipment Center celebrates its trade fair premiere as the first solution for factory-wide, non-proprietary asset and maintenance management. And the new ASM Command Center makes it possible to break up the traditional rigid assignment of operators to specific lines and replace it with software-driven smart operator pools that can be flexibly deployed anywhere. The software prioritizes all assist requests and assigns them via mobile devices to properly trained operators. In addition, ASM subsidiary Critical Manufacturing will present an MES solution that is specifically tailored for the electronics industry’s needs.
The ASM Experience Area
In the Experience Area of the ASM booth, visitors will see a complete SMT line with a DEK TQ high-volume printer, the ASM ProcessExpert SPI system, and SIPLACE TX and SIPLACE TX micron placement solutions. Also shown in action will be the highly flexible DEK NeoHorizon 03iX with the new DEK MASS singulated substrate tool as well as the SIPLACE X4iS and the SIPLACE SX2 equipped with the extensive OSC Package. In addition, the smart supply of materials to lines and machines will be demonstrated with automated robots (AIVs).
The SMT Solutions Segment of ASM Pacific Technology
The mission of the SMT Solutions segment within the ASM Pacific Technology Group (ASMPT) is to implement and support the smart SMT factory at electronics manufacturers worldwide.
ASM solutions such as SIPLACE placement systems and DEK printing systems support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the smart SMT factory in stages and enjoy dramatic improvements in productivity, flexibility and quality.
Since maintaining close relationships with customers and partners is a central component of ASM’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions. In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is establishing together with other SMT manufacturers the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.
For more information about ASM visit www.asm-smt.com
ASM Pacific Technology Limited
Headquartered in Singapore, ASMPT (HKEX stock code: 0522) is a global technology and market leader in leading-edge solutions and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user markets including electronics, mobile communications, automotive, industrial, and LED. The company’s continuous investments in research and development help to provide its customers with innovative and cost-efficient solutions and systems that enable them to achieve higher productivity, greater reliability and enhanced quality.
For more information about ASMPT, visit www.asmpacific.com
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